• Flash setting formulation - bonds most surfaces within 10 seconds, cutting down mitre assembly bonding times when compared to conventional wood adhesives
• High viscosity adhesive – low soak in to give greater bond strength than conventional cyanoacrylates on porous surfaces (eg wood).
• Gap filling – high viscosity adhesive will fill small gaps in mitres etc (up to 0.2mm)
• Economical in use.

• Multitude of industrial applications: Bonds MDF, wood, chipboard, rubber, plastics, Perspex, uPVC ceramics, aluminium and metals
• Ideal for all cornice and profile mitres, trims, picture frames, MDF, skirting and architrave joints, worktop end strips, PVCu trims and much more. It is particularly useful for production lines such as electronics assembly and uPVC window trim bonding.

Mitre Fast Activator:
Chemical Base: Hydrocarbon solvent
Appearance: Colourless

Mitre Fast Adhesive:
Solids: 100 %
Thermal conductivity: 0.2 w/k.m
Gap filling: up to 0.2 mm
Refractive index: 1.45 (cured)
Dielectric strength: 11-13 kV/mm
Dielectric constant: 5.2 @ 1MHz (cured)
Softening point: 165 ºC

SUBSTRATE PREPARATION

The surfaces to be glued should be clean, dry and free from dust, grease and other contaminants. Materials should be stored in a warm environment prior to bonding to avoid chilling of the glue line, which leads to extended setting times. Where possible, ensure working environment has a relative humidity of +50%.

LIMITATIONS

The surfaces to be glued should be clean, dry and free from dust, grease and other contaminants. Materials should be stored in a warm environment prior to bonding to avoid chilling of the glue line, which leads to extended setting times. Where possible, ensure working environment has a relative humidity of +50%.

• Ensure surfaces are degreased prior to bonding.
• Do not use on glass
• Do not use in applications involving constant water immersion.
• Do not use on bitumen or tar-leaching products.